PRE HEATER SS-T12B

1. Supports motherboard layering, tinning, lamination, desoldering, glue removal, screen bracket separation, etc., no need for air gun soldering iron.

2. Suitable for mobile phone motherboards of various sizes.

3. Combined module design, universal base module.

4. Customized temperature adjustment according to different melting points.

5. Quick and accurate layering, tinning, glue removal, motherboard bonding, etc.

6. Applicable to IP16/16Plus/16Pro/16Pro Max to meet your maintenance needs.

7. Intelligent temperature control, customized temperature adjustment according to different melting points, fast heating, long life, uniform temperature.

8. Supports the bonding and separation of Android and IP7G-16PM motherboards, screen bracket separation, etc., fast and accurate layering, tinning, glue removal, motherboard bonding, etc.

9. 360° rotating buckle + guide rail design, suitable for precise clamping of motherboards of different shapes, improving maintenance efficiency.